Short description:
Bond University is inviting application of a number of college scholarships available for international students. The scholarship has a value of 10% remission of tuition for two semesters of the program. Selection is based on high academic achievement.
Deadline:
July 31, 2014
Scholarship awarding institution:
Bond University
Title Type:
Courses
Number of scholarships:
Unknown
Field of study:
Various Subjects
Benefits and Requirements:
To explore the benefits and requirements of this scholarship visit the link given below.
Website:
http://www.bond.edu.au/study-at-bond/scholarships/BD3_016125
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